Chapter 1012: Kidnapping in mind
“The future of silicon-based semiconductors is predictable, but our previous investment cannot be shelved, so we have not stopped pursuing the pursuit of further reducing the failure rate while maintaining device characteristics.
As a technology supplier, we are always looking for ways to achieve higher performance with new equipment, and we are also adjusting the manufacturing process in our fabs. Manufacturing process.
In the wafer fab, we use many innovative process steps for planar gate and trench gate power. Innovation means many errors and difficulty in compatibility. Sometimes a technology A difference in point will result in the scrapping of the entire wafer
For example, a thicker, lightly doped stack will support a higher breakdown voltage, but the on-resistance will increase
.
Therefore, in order to form trenches on the device, in some cases, the trench size has been reduced to 1 μm (micron) or even smaller.
To form the trenches, we must deposit another mask layer over the device and inject dopants into it.
The trenches are patterned, then etched, and finally the source and drain are formed as the trenches are filled with gate material.
Each of these steps is extremely important. We need to thank the technical support provided by our official etching research institute in Daxia, which allows us to use the world's top etching technology. ”
From wafers to wafer cutting, etching, photolithography, chip making, and later, Gu Qing even explained to the executives of these technology companies the direction and specific solutions of his Jiuzhou Technology Company to some semiconductor chip problems. Scheme.
“The so-called 3D chips in the West are actually the same thing as our previous stacked chips. It’s like stacking up the chips layer by layer like building a house, from a set of bungalows to a multi-story residential building.< br>
There are many things that a chip can do It is limited, and its performance is also fixed. If multiple chips are installed flatly, although the performance of the overall processor can be improved, it will cause the chip template area of the core of the processor to be too large, and there will be too many wire interfaces, which can easily cause Glitch.
And 3D Three-dimensional chips and our stacked chips can stack chips one by one to achieve more powerful performance in the same area.
However, this technology will make the chip heat dissipation problem extremely difficult to solve. Once a problem occurs, the processor must be replaced. There is no possibility for consumers to replace a single chip.
And the 3D stacked structure of the processor also puts a great test on the stability of the semiconductor chip during installation. During use, a single bump or shake may cause chip failure.
Our company's semiconductor engineers have studied the chip technology developed by Western technology companies. The silicon-based semiconductor technology we are cooperating with this time is fully capable of stacking chip technology. We can basically make chips that are at least three generations ahead of Western technology companies. chip products.
If partners want to further participate on their own, they can also contact other upstream and downstream technology companies that use our technology to develop their own structures and designs. Although there will not be very powerful chips produced in the short term, As long as you master the rules and methods, you can completely replace the structure every three years, or even upgrade the structure every two years.
But I still hope that the partners can be good students first, study hard, and then have enough foundation and experience to carry out research and development design by themselves, and the chip design project also requires a strong enough person. Completed by a team of engineers.
At present, domestic and foreign enterprises, research institutions and even official organizations have an extremely strong desire for students, tutors, and working staff in this industry.
For those who have ideas about this project, it is best to contact domestic universities to communicate clearly. After all, it is impossible for our company’s technology to be transferred abroad without passing the application review and approval, even if it is to domestic In the company's overseas branches, the personnel who master our technology need to file a report and apply every time. "To be honest, Gu Qing was very serious about what he said. It can even be said that he did not hide any secrets in many projects. He not only clearly explained the technical advantages and disadvantages, but also made the particularity of the project clear and transparent.
When the senior executives of technology companies heard what happened, the mountains and rivers between their eyebrows were no longer ugly, but extremely twisted and weird.
We all know that Jiuzhou Technology cooperates closely with the government, but how did Jiuzhou Technology come up with so many technical sensitive points and prohibited projects? Even let the government set up a special department to manage it?
Which of the companies present, Xia Wei, BYD, and Ningde, does not cooperate with the government? Which company is not a famous name in the industry?
But the cooperation was so close that they even uploaded some core systems to the official platform, and they just did that, but they didn’t have the technical support and protection treatment like Jiuzhou Technology!
Yu Chengdong took a deep breath, pinched his nose with his right hand, and narrowed his eyes slightly.
His own Kirin chip used to use a structure that was optimized and developed based on the arm architecture. Later, he learned the chip structure of Jiuzhou Technology, but so far, Xia Wei still has not "learned from the master".
Only by entering the world of Kyushu's semiconductor field can we understand how terrifying Kyushu technology is.
The young man in front of me actually supported the semiconductor department to develop chips directly from the bottom. Not only did he abandon the MIPS instruction set, he also developed his own instruction set architecture, self-developed AI processor, self-developed program software, and even in production Industrial software platforms and intelligent AI assistance are designed and developed in the process flow.
As scary as it is, Jiuzhou Technology also has the most powerful robotic arm and process manufacturing dust-free workshop in the industry!
These technologies are extremely important not only for the semiconductor chip industry, but also for the production and research and development of other high-tech products.
And those semiconductor switch components...
In a sea of hundreds of millions of transistors, small switches are made accurately.
Even if Gu Qing introduced that there is not much difference in the internal architecture and technical directions between the chips produced by Jiuzhou Technology and the 3D chips produced by Western technology companies, they are both constructed by changing the arrangement and structure of countless transistors inside the chip. Powerful performance architecture improves computing performance.
But the data comparison of sorting and structure, optimization operation and energy consumption ratio are too powerful, right?
If you go by the data given by Zhao Qing, as long as you use Kyushu Semiconductor's technology and carefully engage in chip research and development, you can develop a chip that is twice as powerful as Pingguo's latest chip in up to two years!
When the time comes, we will move the self-developed chips to the 3D structure, and there will be another terrible performance improvement!
At this moment, Yu Chengdong really had the urge to kidnap Gu Qing.
(End of this chapter)